Soft Solder Pastes  Manufacturers, Traders, Suppliers

Fitting solder paste Cu-Rofix®3-Spezial
DIN EN 29453, S-Sn97Cu3, DIN EN 29454.1, 3.1.1.C
for soft soldering of copper piping in rinking water and heating installations
Fitting solder paste Cu-Rofix®4-Spezila
DIN EN 29453, S-Sn97Ag3, DIN EN 29454.1, 3.1.1.C
for soft soldering of copper piping in drinking water and heating installations

Fitting solder paste Cu-Rofix®3
DIN EN 29453, S-Sn97Cu3, DIN EN 29454.1, 3.1.1.C
for soft soldering of copper piping in drinking water and heating installations

Fitting solder paste Cu-Rofix®4
DIN EN 29453, S-Sn97Ag3, DIN EN 29454.1, 3.1.1.C
for soft soldering of copper piping in drinking water and heating installations

Lead-Free Solder Pastes
Almit Lead-Free Solder Pastes - consistent high quality and premium wetting properties. The flux contains a highly efficient wetting agent based on natural resin, the natural water content of which has been dehydrated through a special process. This serves to reduce the danger of tin and flux agent spit back, a troublesome problem that can lead to short-circuit bridges and reduced quality. The unique flux provides for fault-free and efficient soldering, even on oxidized component connections.
Lead-Containing Solder Pastes
Constant quality and premium wetting properties are the characteristics that are typical for Almit Solder Pastes. Only the best and purest of material with uniform particle sizes are processed. This ensures that the features of the paste are always uniform, thus guaranteeing that always the same amount is applied to the stencil plate without having to readjust the stencil printer. The unique, patented paste composition efficiently eliminates the problem of paste sticking in the plate apertures, even in fine and super fine pitch below 0.5 mm structures. In the presence of shear forces, the paste demonstrates exceptionally low-friction properties, comparable to those of graphite.