High Frequency Assembly  Manufacturers, Traders, Suppliers

Unlock unparalleled efficiency in production with high-frequency assembly solutions based on advanced induction technology. Elevate your manufacturing processes with precision and speed, ensuring seamless integration of heating solutions. Explore the potential of high-frequency assembly for diverse applications, optimizing production output and minimizing downtime. Embrace cutting-edge induction technology to achieve superior results in your heating solutions for various industries. Stay ahead in the competitive landscape by harnessing the power of high-frequency assembly, a game-changer in modern production methodologies.

Based on the know-how and lots of experience in RF technology AURION has developed a series of very flexible RIE systems with an outstanding cost-performance ratio.
The range of products offered contains three system sizes for different substrates, throughput and etching rates. According to the high capacity of up to 25 wafers (Ø 150 mm) or 20 wafers (Ø 200 mm) and despite a small footprint (max. 1.5 m² in the clean room) a throughput of more than 100,000 wafers per year is possible even without an expensive automatic handling system.
This is very interesting, not only for companies with a small capital budget.