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Sputtering
A COATING PROCESS WITH PLASMA
Sputtering generally means to eject atoms from a solid state target by "bombarding" it with accelerated gas ions. This technique is often used for the deposition of thin films.
Therefore a gas discharge is ignited in an inert gas (i.e. argon). The positive gas ions are accelerated towards a negative charged target where they eject atoms by direct momentum transfer. These atoms diffuse into the vacuum chamber surrounding the sputtering arrange-ment and condense as a thin film on substrate and chamber walls. Furthermore secondary electrons which keep the gas discharge running are set free.