Montaj parçaları  Üreticiler, Satıcılar, Teslimatçılar

Founded in 1909 our company is specialized in the manufacturing of technical springs used in all industrial branches all over the world.
Each of our products is produced as desired by our customer and is adjusted to their purpose. Hence our products provide a variety of functions and molds.
Frequently we could support our customers with our experience to design and develop their individual product. Hence testing times can be shortened and we can help you to simplify the producibility of your product. With decades of know-how, our qualified engineers and skilled workers ensure the best possible relation between performance, design and costs for your product. Please do not hesitate to contact us directly.

RigidPCB Capabilities:ItemDescriptionTechnical capabilities1Layers1-50 Layers2Max. Board Size2000×800mm(79uff02×32uff02)3Material:FR-4u3001High TG FR4u3001Halogen Free Material, Rogersu3001Arlonu3001PTFEu3001Taconicu3001Isola, Ceramics, Aluminum, Copper base etc4Max. Board Thickness330mil(8.4mm)5Min. Inner Line Width / Space3mil(0.075mm) / 3mil(0.075mm)6Min. Outer Line Width / Space3mil(0.75mm) / 3mil(0.075mm)7Min. Finish Hole Size4mil(0.10mm)8Max. Aspect ratio16:19Min Via Hole Size & Padvia: dia. 0.2mm / pad: dia. 0.4mm ; HDI 1012 Ω Normal17Thermal Shock288 u2103, 20 sec18Warp and Twist≤0.5%19Electric Strength>1.3kv/mm20Solder Mask Hardness≥6H21Flammability94V -022Min Solder Mask Coverage0.05mm(2mil)22Surface FinishingOSPu3001ENIGu3001Flash Goldu3001Immersion Tinu3001HASLu3001Tin Platingu3001Immersion Silver ,Carbon Ink, Peel-off Mask, Gold Fingers (30μ"), Immersion Silver (3~10u"), Immersion Tin (0.6~1.2um).24V-Cut Angle30° 45° 60° , tolerance +/- 5°25Min V-Cut Board Thickness0.75mm26Min. Blind/Buried Via0.15mm (6mil)FPC, Rigid-Flex Circuit Board Capabilities:ItemDescriptionTechnical capabilities1LayersFPCBuff1a8 layers R-FPCBuff1a20 layers2Max. Board Size2000×800mm(79”×32”)3Base CopperMin. Thicknessuff1a1/3OZ(FPCB) Max. Thicknessuff1a2OZ(FPCB)4Min. Finished Thickness

ISO9001: 2008, ISO13485: 2003