Ceramic Substrates  Manufacturers, Traders, Suppliers

Industrial ceramic substrates are high-performance materials widely used in electronics, automotive, aerospace, and energy industries due to their exceptional thermal, mechanical, and electrical properties. Typically composed of alumina (Al₂O₃), aluminum nitride (AlN), or silicon carbide (SiC), these substrates serve as critical components in circuits, sensors, and power modules.

Manufacturing Process
The production of ceramic substrates involves several key steps:
Raw Material Preparation: High-purity ceramic powders (e.g., alumina) are mixed with binders and solvents to form a homogeneous slurry.
Tape Casting or Dry Pressing: The slurry is cast into thin sheets (tape casting) or compacted under high pressure (dry pressing) to form green bodies.
Debinding: The green bodies undergo thermal treatment to remove organic binders, leaving a porous structure.
Sintering: The debinded ceramic is fired at high temperatures (1,500–1,800°C) to achieve densification and enhance mechanical strength.
Surface Finishing: Post-sintering processes like laser cutting, polishing, or metallization (e.g., screen-printing conductive layers) are applied for functionalization.
Key Properties
High Thermal Conductivity (e.g., AlN: 170–200 W/m·K) for heat dissipation.
Electrical Insulation with low dielectric loss.
Mechanical Robustness (high hardness and wear resistance).
Chemical Stability against corrosion and oxidation.

Applications
Electronics: PCB bases, LED packaging, and semiconductor insulators.
Automotive: Engine sensors, power electronics for EVs.
Energy: Substrates for fuel cells and solar panels.
Future Trends
Advancements in nano-ceramics and additive manufacturing (e.g., 3D-printed substrates) are expanding their use in miniaturized and high-power devices.

Alumina ceramic substrate is the preferred material for current hybrid integrated circuits.
It is widely used to make various microwave devices, such as dielectric resonators, filters,
dielectric antennas, dielectric waveguide circuits, etc. It can meet technological fields for
the integration, miniaturization, high reliability, and low cost of microwave circuits.

Controllable electrical properties, high flexural,strength and smooth surface roughness

Integrated Circuit Packaging and Electronic Component Manufacturing

Ceramic Substrates PCB: High - Performance and Reliable

In the field of printed circuit boards (PCBs), Ceramic Substrates PCBs have emerged as a preferred choice for applications demanding high - performance and reliability. Our company specializes in manufacturing Ceramic Substrates PCBs with remarkable production capabilities.Our production capacity enables us to meet large - scale demands efficiently. Equipped with state - of - the - art facilities and advanced manufacturing technologies, we can produce 80,000 square meters of Ceramic Substrates PCBs per month. This high - volume production capacity, combined with strict quality control processes, ensures that our customers receive a consistent supply of top - notch products.Ceramic Substrates PCBs offer several advantages over traditional PCB materials, backed by impressive specification parameters. For thermal conductivity, Aluminum Nitride (AlN) substrates achieve up to 320 W/mK, while Alumina (Al₂O₃) substrates reach 20 - 30 W/mK. This high heat - dissipation ability effectively solves the problem of high - power devices overheating, making them ideal for applications in power electronics, LED lighting, and automotive electronics.Regarding thermal stability, Ceramic Substrates PCBs can operate in a wide temperature range. Alumina substrates typically function from - 50 ºC to 800 ºC, while Aluminum Nitride ones can withstand up to 1000 ºC. Their coefficient of thermal expansion (CTE) varies: Alumina has a CTE of 7 - 8 ppm/ºC, and Aluminum Nitride is around 4.5 ppm/ºC, closely matching many chip materials and reducing failures caused by thermal stress.In terms of electrical properties, ceramic materials exhibit high dielectric strength. Alumina has a dielectric constant of about 9 - 10 at 1 MHz, and Aluminum Nitride shows 8.5 - 9.0, providing excellent insulation performance suitable for high - voltage environments. These substrates also support high - density integration, allowing for fine circuits with a line width / spacing ≤ 50 μm through laser drilling and precision circuit processing, which is beneficial for high - frequency and high - speed circuit design. Moreover, their corrosion resistance ensures stable performance in harsh environments, extending the equipment life.